Lucent Technologies 555-233-119 Procedure 2

DEFINITY ECS Release 8.2 Maintenance for R8.2csi 555-233-119 Issue 1
April 2000
Maintenance Objects
3-1065TDM-BUS (TDM Bus)
3
Procedure 2
This procedure removes and re-inserts port circuit p acks; one or several at a
time.
If all of the TDM Bus tests pass when the circ uit pack is removed, b ut some of the
tests fail when the circuit pac k is inserted, the circ uit pack is the c ause of the
problem and should be replaced . If some of the tests fail regardless of whether
the circuit pac k is inserted or removed, the c ircuit pack is not the c ause of the
problem (see Note). Repeat this proc edure for each purp le slot circuit pac k in the
Port Ne twork .
NOTE:
Of course, in a multiple failure situation, the c ircuit pack may b e one cause
of the TDM Bus problem and there may b e other failures that are causing
TDM Bus faults. Also, the circuit pac k itself may not be the cause of the
problem, but the b ackplane pins m ay have been bent when the c ircuit pack
was inserted.
1. Remove port circuit pac ks which have failed the NPE Crosstalk Test (#6)
first. To find which circuit packs failed this test, display the Hard ware Error
Log via the display errors command . Refer to the Maintenance
documentation of each p ort circuit p ack that has port errors to c heck if
any error indicates the failure of the NPE Crosstalk Test.
2. If no circuit pack failed the NPE Crosstalk Test (#6), remove one or several
purple slot circ uit p acks.
3. Run the test tdm P command.
4. If any of the TDM Bus tests fail:
■Check if the backp lane pins in the removed c ircuit pack’s slot
appear to be bent.
■If the backplane p ins are bent, straighten or replac e the pins,
re-insert the circuit pac k, and do this proc edure again for the same
circuit pack.
■If the backplane pins are not bent, re-insert the circuit pac k and do
this procedure for the next set of c ircuit packs.
5. If none of the TDM Bus tests fail:
■Re-insert the circuit pack.
■Run the test tdm system technician command .
■If any of the TDM Bus tests fail, the re-inserted circuit p ack is faulty.
Replace the circuit p ack and do this p rocedure again for the new
circuit pack.
■If none of the TDM Bus tests fail, then the problem has b een fixed.