Lucent Technologies Release 7 Procedure for PPN with Simplex SPE or EPN with Simplex PNC

DEFINITY Enterprise Communications Server Release 7
Maintenance for R7r
555-230-126 Issue 4 June 1999
Maintenance Object Repair Procedures
9-1707TDM-BUS (TDM Bus)
9
■UN332 MSSNE T
■TN570 Expansion Interface
Although the Packet Interface c ircuit pack doe s not communicate over the TDM
bus, the bus does ter minate at those slots. TDM Bus failures could b e caused by
bent backplan e p ins.
When running TDM Bus diagnostics i n an EPN, the following circuit packs sho uld
be tested with this proc edure:
■TN570 Expansion Interface
■TN768/TN780 Tone/Clock
When using this procedure on an EPN, the Tone/Clock circuit p ack should be the
next-to-last one checked. The Expansion Inter face circuit pac k (TN570) should
be the last one checke d, since removing this c ircuit pack disc onnects its EPN. In
a system with duplicated PNC, disruption of traffic can be mini mized by following
the procedure for the stand by TN570 Expansion Interface circ uit pack, then
entering a reset pnc interchange. The formerly active Expansion Inte rface will
now be standby and can be checked without affecting service to the EPN.
At steps in the proced ure that require the removal and/or replace ment of circuit
packs, refer to the Maintenance O bject documentation for the given circuit pa ck
for in struc tions . SPE and /or PNC interc hang es ma y be re quir ed to c omp lete
these steps with the least amount of service disruption.
Procedure for PPN with Simplex SPE or EPN
with Simplex PNC
1. Remove the suspect circuit p ack.
2. As in Procedure 2, determine if the b ackplane pins in the removed circuit
pack’s slot are bent.
3. If the backplane p ins are bent, do the following:
a. Power down the control carrier as d escribed in the previous
warning statement.
b. Straighten or replace the p ins.
c. Insert the same circuit p ack.
d. Turn the power back on to reboot the system or to restar t the EPN.
e. Run test tdm P to determine if the TDM Bus fault still exists.
f. If none of the TDM Bus test fail, the procedure is c omplete.
g. If some of the TDM Bus tests fail, replace the sus pect circuit p ack
and go to step 6.
4. If the backplane p ins are not bent, replace the circ uit pack.
5. Turn the power back on to reboot the system.